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M112
M112
Mfr.Part#
Description
Manufacturer
In Stock
Operation
MS2441
RF TRANS NPN 65V 1.15GHZ M112
Microsemi Corporation
2216
+ Bom
MS2472
RF TRANS NPN 65V 1.15GHZ M112
Microsemi Corporation
3045
+ Bom
MS2473
RF TRANS NPN 65V 1.09GHZ M112
Microsemi Corporation
6192
+ Bom
Other Package
30-DMP
1596-BFBGA
14-TSSOP (0.173, 4.40mm Width) Exposed Pad
TO-99-8 Metal Can
208-BFCQFP with Tie Bar
TO-208AA, TO-48-3, Stud
241-BBGA, FCBGA
88-QFN (12x12)
12-WQFN Exposed Pad
8-XDFN Exposed Pad
40-TFSOP (0.488, 12.40mm Width)
32-CDIP (0.900, 22.90mm)
8-CERDIP
32-WFQFN Exposed Pad, CSP
36-VQFN
Hot Package
10-TFSOP
10MSOP
10-LCCC Exposed Pad
100-CLCC
10LFCSP
8 SOIC
20/TSSOP
8-PDIP
MSOP-8
12-DIP(0.300",7.62mm)
SOT-23-3
10-SIP Module, 9 Leads, Formed Leads
25A/1600V/SCR/2U
124-TFQFN Dual Rows
6-CLCC