Eiyu

BOM/RFQ3 Login
BOM/RFQ3 Login
  • Home
  • Products
  • Manufacturers
  • RFQ
  • Hot
  • About
  • Language
    • English
    • 日本語
    • Deutsch
    • Français
    • Español
    • 영어
    • Английский
    • Tiếng Anh
    • 中文
Home / Package / 356-BBGA Exposed Pad

356-BBGA Exposed Pad

Mfr.Part# Description Manufacturer In Stock Operation
ISL59532IKEZ IC CROSSPOINT SW 32X32 356BGA 7433

+ Bom

EPF10K100EBC356-1N IC FPGA 274 I/O 356BGA 101

+ Bom

EP20K100EBC356-3 IC FPGA 246 I/O 356BGA 3095

+ Bom

EPF10K50VBC356-2 IC FPGA 274 I/O 356BGA 3671

+ Bom

EPF10K50VBI356-3 IC FPGA 274 I/O 356BGA 6175

+ Bom

Other Package

  • 16-PowerTSSOP (0.173, 4.40mm Width)
  • 20-HTSSOP
  • 16-VQFN, CSP
  • TO-8 Style, 12 Leads
  • 20-CFlatPack
  • 28-UFBGA, DSBGA
  • 536-LFBGA, CSPBGA
  • 1031-BFBGA, FCBGA
  • 165-BFCPGA
  • 16-CDIP
  • 64-VFQFN Dual Rows, Exposed Pad
  • SOD-80 Variant
  • 169-BGA
  • 144-BFQFP
  • TO-226-2, TO-92-2 (TO-226AC) Formed Leads

Hot Package

  • 100-LQFP
  • 8-SOIC (0.154, 3.90mm Width)
  • 10-CSOIC
  • 100TQFP
  • 100LQFP
  • 1017-FBGA
  • µDFN-6
  • 16 SOIC
  • SOT233
  • 4SC70
  • 8 DFN
  • 2-UDFN
  • PG-TO263-3
  • Die
  • SC-79, SOD-523

Company

About Us

Contact Us

Blog

Ordering

Payments

Shipping & Packing

Return & Refund Policy

Support

BOM Tool

Information

Privacy Policy

Contact Us

[email protected]

Newsletter

Subscribe

COPYRIGHT ©2026 EIYU.COM ALL RIGHTS RESERVED