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Home / Package / D2PAK-3 (TO-263-3)

D2PAK-3 (TO-263-3)

Mfr.Part# Description Manufacturer In Stock Operation
IPB65R110CFDA 5017

+ Bom

IPB048N15N5 9738

+ Bom

LM1117SX-3.3 6372

+ Bom

IPB60R380C6 3598

+ Bom

Other Package

  • 40-CDIP
  • 24-LSSOP (0.24, 6.00mm Width)
  • PQFN-36
  • 169-LBGA
  • 179-LFBGA
  • 32-VFQFN Exposed Pad, CSP
  • SQ-MELF, E
  • 100-UFBGA
  • 20-SMD Module
  • 44-VQFN Dual Rows, Exposed Pad
  • 64-UFBGA
  • 4-SIP, GBU
  • 20-WQFN Exposed Pad, CSP
  • 24-CDIP (0.300, 7.62mm) Window
  • 6-WFDFN Exposed Pad

Hot Package

  • 100-LQFP
  • 8 DFN
  • SOT-235
  • TO-220-3
  • PG-TO263-3
  • SOT233
  • 100LQFP
  • 1017-FBGA
  • 48-VFQFN Exposed Pad
  • 16 SOIC
  • 16-SOIC (0.154, 3.90mm Width)
  • 8-SOIC (0.154, 3.90mm Width)
  • 1156FCBGA
  • 10-CLCC
  • 4SC70

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