AS4C64M16D2A-25BIN

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AS4C64M16D2A-25BIN

IC DRAM 1GBIT PARALLEL 84FBGA

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Specifications

Package Tray
ProductStatus Active
MemoryType Volatile
MemoryFormat DRAM
Technology SDRAM - DDR2
MemorySize 1Gb (64M x 16)
MemoryInterface Parallel
ClockFrequency 400 MHz
WriteCycleTime-WordPage 15ns
AccessTime 400 ps
Voltage-Supply 1.7V ~ 1.9V
OperatingTemperature -40°C ~ 95°C (TC)
MountingType Surface Mount
Package/Case 84-TFBGA

Overview

Description

The AS4C64M16D2A-25BIN is a high-performance, low-power DRAM (Dynamic Random Access Memory) module produced by Alliance Memory. It features a 64M x 16-bit configuration, offering a total memory capacity of 1GB. Operating with a voltage of 2.5V, it is designed for compatibility with various applications, including consumer electronics, telecommunications, and computing devices.
This DRAM operates at a clock speed of 200 MHz, providing fast data access and efficient performance. It utilizes a double data rate (DDR) interface to enhance throughput while maintaining lower power consumption compared to traditional DRAM solutions. The AS4C64M16D2A-25BIN is available in a compact, industry-standard TSOP II package, making it suitable for space-constrained applications.
Overall, this memory chip is an ideal choice for designers seeking reliable and efficient memory solutions in their electronic systems.

Features

The AS4C64M16D2A-25BIN is a 1Gb (gigabit) DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip, organized as 64M x 16 bits. Key features include:
1. Technology: DDR3, providing improved speed and efficiency over previous DDR generations.
2. Data Rate: Operates at data rates up to 1600 MT/s (mega-transfers per second).
3. Voltage: Operates at a low voltage of 1.5V, with a potential for low-power modes.
4. Package: Available in a compact 78-ball TFBGA package.
5. Burst Length: Supports burst lengths of 4 and 8.
6. Latency: Offers low latency for faster operational speed.
7. Density: 1Gb density suitable for various applications, including consumer electronics, networking, and industrial systems.
8. Interface: Compliant with the DDR3 SDRAM standard, ensuring compatibility with various controllers and systems.
These features make the AS4C64M16D2A-25BIN a suitable choice for high-performance memory applications.

Package

The AS4C64M16D2A-25BIN is packaged in a 78-ball TFBGA (Thin Fine Ball Grid Array) format.

Pinout

The AS4C64M16D2A-25BIN is a 1 Gigabit (64M x 16) DDR3 SDRAM memory chip with a pin count of 78. It is organized in a double data rate (DDR) configuration and operates at a speed of 800 Mbps with a 25 ns access time.
The primary functions of the pins include data input/output, address input, control signals, and power supply connections. Key pins include:
- DQ (Data Input/Output): 16 pins for data transfer.
- A (Address): 13 pins for addressing memory locations.
- BA (Bank Address): 2 pins for selecting the bank.
- CS (Chip Select): Determines if the chip is selected for operation.
- WE (Write Enable) and RAS/CAS (Row/Column Address Strobe): Control signals for read/write operations.
- CK/CKE (Clock/Clock Enable): For timing control of the memory operations.
- VDD/VSS: Power supply and ground connections.
This chip is typically used in consumer electronics, computing devices, and embedded systems.

Manufacturer

The AS4C64M16D2A-25BIN is manufactured by Alliance Semiconductor Corporation. Alliance Semiconductor is a company that specializes in designing and manufacturing advanced semiconductor solutions, particularly in memory products such as DRAM and SRAM. Founded in 1987, the company focuses on providing high-performance memory and storage solutions for various applications, including consumer electronics, telecommunications, and industrial systems. Alliance Semiconductor operates as a global player in the semiconductor industry, catering to diverse markets with innovative technology and product offerings.

Application

The AS4C64M16D2A-25BIN is a 64Mb DDR3 SDRAM memory chip commonly used in applications such as consumer electronics, mobile devices, graphics cards, and networking equipment. Its features make it suitable for high-performance computing tasks, including data storage, buffering, and caching in devices like tablets, smartphones, and industrial machinery.

Equivalent

The AS4C64M16D2A-25BIN is a 1Gb (64M x 16) DDR3 SDRAM chip. Equivalent products include:
1. MT41J128M16HA-125:E
2. H5TQ2G63AFR-PBA
3. K4B4G1646Q-HYK0
4. IS43DR16720D-25BLI
Ensure to verify specifications such as speed, voltage, and package type before substitution.

Shipping

Shipping MethodsWe

offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.


Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

Payments

Payment Methods

The Payment term is 100% Prepaid.

Currently, we only accept the below payment methods:

1. PayPal

2. Credit/ Debit Card

3. Wire Transfer

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