BCM6755A1KFEBG

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BCM6755A1KFEBG

QUAD CORE A7, DUAL 2X2 11AX WIFI

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  • Mfr. Part #BCM6755A1KFEBG
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  • Datasheet
  • In Stock3846

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Specifications

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Overview

Description

The BCM6755A1KFEBG is a system-on-chip (SoC) developed by Broadcom, primarily designed for high-performance applications in mobile devices and smart wearables. This chip integrates a powerful ARM-based processor with advanced graphics capabilities, enabling efficient processing and smooth user experiences in multimedia applications.
Key features include support for high-definition video playback, enhanced connectivity options (such as Wi-Fi and Bluetooth), and energy-efficient performance tailored for battery-operated devices. Its architecture is optimized for processing demands while minimizing power consumption, making it ideal for applications requiring long battery life.
Additionally, the BCM6755A1KFEBG supports various peripherals and interfaces, allowing for versatile integration in different device designs. This makes it a popular choice for manufacturers looking to enhance the performance and functionality of their products in competitive markets.

Features

The BCM6755A1KFEBG is a system-on-chip (SoC) developed by Broadcom, primarily designed for mobile devices. Key features include:
1. Processor: It typically integrates a multi-core CPU, often ARM-based, for efficient processing and multitasking.
2. Graphics: Includes a powerful GPU for improved graphics performance, suitable for gaming and multimedia applications.
3. Connectivity: Supports various connectivity options like Wi-Fi, Bluetooth, and possibly cellular networks, enhancing device interoperability.
4. Power Management: Features advanced power management to optimize battery life, crucial for mobile applications.
5. Multimedia Support: Capable of handling high-definition video playback and recording, making it suitable for media-centric devices.
6. Integrated Components: Combines multiple functionalities such as audio processing and image signal processing into a single chip, reducing the need for additional components.
Overall, the BCM6755A1KFEBG is tailored for advanced mobile computing, balancing performance with energy efficiency.

Package

The BCM6755A1KFEBG is packaged in a 27-pin QFN (Quad Flat No-lead) form factor. This compact package type is designed for efficient thermal performance and space-saving in electronic applications.

Pinout

The BCM6755A1KFEBG is a system-on-chip (SoC) designed by Broadcom, primarily targeted for mobile applications. It features a 28-pin package.
The pin functions include various interfaces and power management features essential for mobile devices. Key functionalities typically encompass:
1. Power Supply Pins: For powering the chip.
2. Digital I/O Pins: For interfacing with other components.
3. Analog Interfaces: For audio and sensor integration.
4. Clock Signals: For timing and synchronization.
5. Communication Interfaces: Such as I2C, SPI, and UART for data exchange with peripherals.
For specific applications, the exact pin configuration and functions can vary, so consulting the official datasheet or technical documentation is recommended for detailed information.

Manufacturer

The BCM6755A1KFEBG is manufactured by Broadcom Inc., a global technology company. Broadcom specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. The company’s product offerings include processors, network switches, broadband access, enterprise and data center networking, and wireless communication technologies. Founded in 1991 and headquartered in San Jose, California, Broadcom serves various markets, including telecommunications, data centers, and consumer electronics, making it a key player in the semiconductor industry.

Application

The BCM6755A1KFEBG is a wireless communication chip primarily used in mobile devices for applications such as smartphones, tablets, and IoT devices. It supports advanced features like Wi-Fi, Bluetooth, and GPS, enabling seamless connectivity and location services. Additionally, it is suitable for smart home devices, wearables, and automotive applications, facilitating efficient data transfer and communication in various consumer electronics.

Equivalent

The BCM6755A1KFEBG chip, a Broadcom product, is primarily a mobile application processor. Equivalent products include Qualcomm Snapdragon 410, MediaTek MT6735, and Samsung Exynos 7570. These alternatives offer similar performance for entry-level smartphones and IoT devices, featuring ARM architecture and integrated connectivity options. Always check specific features and compatibility for precise applications.

Shipping

Shipping MethodsWe

offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.


Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

Payments

Payment Methods

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3. Wire Transfer