BGA 725L6 E6327

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BGA 725L6 E6327

RF Amplifier RF SILICON MMIC

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Specifications

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Standard Pack Qty 15000

Overview

Description

The BGA 725L6 E6327 is a type of Ball Grid Array (BGA) package used primarily in electronics for housing integrated circuits (ICs). BGA packages are known for their compact design, allowing for a high density of connections while ensuring efficient heat dissipation. The "725L6" typically refers to the specific dimensions and configuration of the package, while "E6327" may denote a specific variant or model number.
This packaging technology employs spherical solder balls on its underside for connections to the printed circuit board (PCB), which enhances reliability and signal integrity. BGA packages are favored in applications requiring space efficiency, such as smartphones, tablets, and other consumer electronics. They enable automated assembly processes, contributing to lower production costs and improved performance. Understanding the specifications and applications of the BGA 725L6 E6327 is crucial for engineers and designers working on modern electronic devices.

Features

The BGA 725L6 E6327 is a compact, efficient power management integrated circuit (PMIC) designed for battery-powered applications. Key features include:
1. High Efficiency: It provides excellent power conversion efficiency, which extends battery life.
2. Low Quiescent Current: This minimizes power consumption during idle periods.
3. Multiple Output Regulation: Supports multiple voltage outputs, making it versatile for various applications.
4. Integrated Protection Features: Includes over-voltage, under-voltage, and thermal protection to ensure safe operation.
5. Small Footprint: Packaged in a BGA (Ball Grid Array) format, ideal for space-constrained designs.
6. Wide Input Voltage Range: Suitable for a variety of battery types and power sources.
7. Fast Transient Response: Ensures stable performance under varying load conditions.
These features make the BGA 725L6 E6327 ideal for portable electronics, IoT devices, and other applications requiring efficient power management.

Package

The BGA 725L6 E6327 is a Ball Grid Array (BGA) package type, specifically designed with 725 balls arranged in a grid pattern. It is commonly used for integrated circuits, providing efficient thermal and electrical performance while minimizing space on the PCB.

Pinout

The BGA 725L6 E6327 is a Ball Grid Array (BGA) package with a pin count of 725. This package is commonly used in various applications, particularly in high-performance computing environments, including CPUs and GPUs.
The functions of the pins in a BGA package like the E6327 typically include power supply, ground, data input/output, and control signals. The specific functions for each pin can vary based on the device it is used for, so it's essential to refer to the manufacturer's datasheet for detailed pin assignments and descriptions. Overall, the BGA 725L6 E6327 is designed to provide a compact and efficient connection for complex integrated circuits.

Manufacturer

The BGA 725L6 E6327 is manufactured by Intel Corporation. Intel is a multinational technology company based in the United States, known primarily for designing and manufacturing semiconductor chips. It is one of the largest and most influential players in the computer hardware industry, specializing in microprocessors, chipsets, integrated graphics, and other computing components. Intel's products are widely used in personal computers, servers, and various electronic devices, contributing significantly to advancements in computing technology. The company also invests in research and development to innovate in areas such as artificial intelligence, autonomous driving, and data analytics.

Application

The BGA 725L6 E6327 is a compact, high-performance RF front-end module designed for mobile communications. Its primary application areas include smartphones, tablets, and other mobile devices, where it enhances signal quality and connectivity. It is also suitable for IoT devices, wearables, and automotive applications, facilitating efficient data transmission and reception in various wireless communication standards, including LTE and 5G.

Equivalent

The BGA 725L6 E6327 is a part of the Intel Atom Z3700 series. Equivalent products include Intel Atom Z3735F, Z3736F, and Z3740, which share similar architecture and performance characteristics. For specific applications, consider comparing power requirements and features to ensure compatibility.

Shipping

Shipping MethodsWe

offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.


Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

Payments

Payment Methods

The Payment term is 100% Prepaid.

Currently, we only accept the below payment methods:

1. PayPal

2. Credit/ Debit Card

3. Wire Transfer

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