BGM220SC22HNA2

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BGM220SC22HNA2

RF TXRX MOD BLUETOOTH CHIP SMD

  • Manufacturer
  • Mfr. Part #BGM220SC22HNA2
  • Package
  • Datasheet
  • In Stock7344

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Specifications

Part Status Active
Base Product Number BGM220
DigiKey Programmable Not Verified
RF Family/Standard Bluetooth
Protocol Bluetooth v5.2
Modulation GFSK
Frequency 2.4GHz ~ 2.4835GHz
Data Rate 2Mbps
Power - Output 6dBm
Sensitivity -106.4dBm
Serial Interfaces ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART
Antenna Type Integrated, Chip
Utilized IC / Part EFR32BG22
Memory Size 512kB Flash, 32kB RAM
Voltage - Supply 1.8V ~ 3.8V
Current - Receiving 4.2mA ~ 4.8mA
Current - Transmitting 4.6mA ~ 8.8mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 44-SMD Module

Overview

Description

The BGM220SC22HNA2 is a Bluetooth Low Energy (BLE) System-on-Chip (SoC) designed for IoT applications. It features a 32-bit ARM Cortex-M33 processor with secure and efficient processing capabilities, making it suitable for low-power devices. The SoC integrates a radio transceiver, allowing for robust wireless communication, and supports a variety of BLE protocols.
Key specifications include:
- Memory: Up to 512 KB Flash and 128 KB RAM.
- Power Consumption: Optimized for low energy usage, making it ideal for battery-operated devices.
- Connectivity: Built-in BLE 5.0 support for extended range and data throughput.
- Security Features: Hardware-based security capabilities for secure boot and encrypted communication.
The BGM220 is often used in applications such as smart home devices, wearables, and industrial sensors, enabling seamless connectivity and efficient performance. Its comprehensive development ecosystem facilitates easy integration and rapid prototyping for developers.

Features

The BGM220SC22HNA2 is a Bluetooth Low Energy (BLE) module designed for IoT applications. Key features include:
- Bluetooth 5.1: Ensures enhanced range and data rate capabilities.
- Integrated Antenna: Simplifies design and reduces external components.
- Low Power Consumption: Ideal for battery-operated devices, supporting sleep modes.
- ARM Cortex-M33 Processor: Offers efficient processing with a clock speed of up to 38.4 MHz.
- Memory: 256 kB Flash and 32 kB RAM facilitate complex applications.
- Rich Peripheral Set: Includes GPIO, ADC, SPI, I2C, and UART interfaces for connectivity.
- Security Features: Built-in hardware security with TrustZone support.
- Development Support: Compatible with the Simplicity Studio IDE for easy application development.
- Compact Size: Small form factor, suitable for various compact designs.
These features make the BGM220SC22HNA2 suitable for applications such as smart home devices, wearables, and industrial automation.

Package

The BGM220SC22HNA2 is a Bluetooth module from Silicon Labs, packaged in a 24-pin QFN (Quad Flat No-lead) format. This compact package is designed for ease of integration in various applications, providing robust wireless connectivity in a small footprint.

Pinout

The BGM220SC22HNA2 is a Bluetooth system-on-chip (SoC) from Silicon Labs, featuring a total of 22 pins. This device is designed for low-power applications and incorporates both Bluetooth 5.1 technology and an integrated antenna.
The pin functions include:
1. Power Pins: For power supply input.
2. Ground Pins: For grounding the device.
3. GPIO Pins: General-purpose input/output pins for interfacing with other components.
4. UART: Used for serial communication.
5. SPI: Serial Peripheral Interface for connecting with peripherals.
6. I2C: For connecting to I2C-compatible devices.
7. ADC: Analog-to-digital converter pins for reading analog signals.
8. Reset Pin: For resetting the device.
9. Debugging Pins: For programming and debugging the SoC.
This versatile pin configuration allows the BGM220SC22HNA2 to support various applications in the Internet of Things (IoT) space.

Manufacturer

The BGM220SC22HNA2 is manufactured by Silicon Labs, a company specializing in the design of silicon, software, and solutions for a variety of applications, particularly in the fields of the Internet of Things (IoT), automotive, and industrial markets. Silicon Labs is known for its innovative wireless technology, microcontrollers, and mixed-signal ICs. The BGM220 series, specifically, is a Bluetooth module aimed at enabling low-power wireless communication in connected devices. The company focuses on providing high-performance, energy-efficient solutions that facilitate connectivity and automation in a wide range of electronic products.

Application

BGM220SC22HNA2 is a versatile Bluetooth Low Energy (BLE) module used in various application areas, including smart home devices, wearable technology, health monitoring, industrial automation, and IoT (Internet of Things) solutions. Its low power consumption and compact design make it suitable for applications requiring wireless connectivity with minimal energy usage.

Equivalent

The BGM220SC22HNA2 chip is a Blue Gecko Bluetooth low energy (BLE) module. Equivalent products include:
1. Nordic Semiconductor nRF52832
2. Silicon Labs EFR32BG22
3. Texas Instruments CC2640R2F
4. Microchip RN4871
Ensure to validate specifications, power requirements, and compatibility for your specific application.

Shipping

Shipping MethodsWe

offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.


Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

Payments

Payment Methods

The Payment term is 100% Prepaid.

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2. Credit/ Debit Card

3. Wire Transfer

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