BSM150GB60DLC

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BSM150GB60DLC

IGBT Modules 600V 150A DUAL

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Specifications

Packaging Tray
Standard Pack Qty 10

Overview

Description

The BSM150GB60DLC is a semiconductor device, specifically a IGBT (Insulated Gate Bipolar Transistor) module used primarily in various applications such as motor drives, power inverters, and renewable energy systems. This module combines the high-efficiency characteristics of MOSFETs with the high-voltage and high-current capabilities of bipolar transistors, making it suitable for applications requiring robust power control.
The "150" in the designation indicates the current rating of 150A, while "GB" refers to the series which has specific operational characteristics. The "60" denotes the maximum voltage rating of 600V. The "DLC" suffix typically indicates a specific package type or mounting configuration.
Key features of the BSM150GB60DLC include low switching losses, high thermal performance, and a compact design, which facilitate easy integration into various power electronics systems. It is designed for efficiency and reliability in demanding environments, making it a popular choice for engineers in the power electronics industry.

Features

The BSM150GB60DLC is an IGBT (Insulated Gate Bipolar Transistor) module designed for high-performance applications. Key features include:
1. Voltage Rating: Operates at a maximum collector-emitter voltage of 600V.
2. Current Rating: Supports a continuous collector current of up to 150A.
3. High Efficiency: Offers low switching and conduction losses, making it suitable for energy-efficient applications.
4. Thermal Management: Features a built-in thermal interface for effective heat dissipation.
5. Compact Design: Modular format allows for easy integration into power electronics systems.
6. Robustness: Designed for reliability in harsh environments, including automotive and industrial applications.
7. Fast Switching: Capable of high-speed switching, enhancing performance in inverter and converter designs.
8. Protection Features: Integrated protection against overcurrent and thermal overload conditions.
Overall, the BSM150GB60DLC is ideal for applications such as motor drives, renewable energy systems, and power supply inverters.

Package

The BSM150GB60DLC is packaged in a DBC (Direct Bond Copper) module format. This type of packaging is designed for high power and efficiency, allowing for effective thermal management and electrical performance in various applications, particularly in power electronics.

Pinout

The BSM150GB60DLC is a 150A, 600V IGBT module designed for industrial applications. It features a total of 12 pins. The pin functions are as follows:
1. Collector Pins (C): 1, 2, 3, and 4 - These are connected to the collector terminals of the IGBTs.
2. Emitter Pins (E): 5, 6, 7, and 8 - These are connected to the emitter terminals of the IGBTs.
3. Gate Pins (G): 9 and 10 - These are used for gate control of the IGBT switches.
4. Thermal and Auxiliary Pins: 11 - Typically used for temperature sensing or other auxiliary functions.
5. N/C Pin: 12 - Not connected.
This module is commonly utilized in applications such as motor drives and power supplies, providing efficient switching and thermal performance.

Manufacturer

The BSM150GB60DLC is manufactured by Infineon Technologies AG. Infineon is a German semiconductor manufacturer known for its products in the fields of automotive, industrial power control, and security technologies. The company specializes in producing power semiconductors, microcontrollers, and sensors, catering to various sectors including automotive, industrial automation, and consumer electronics. Infineon is recognized for its innovation in power management and energy efficiency solutions, contributing significantly to advancements in electric mobility and renewable energy systems.

Application

The BSM150GB60DLC is a 150A IGBT module used in various applications, including industrial motor drives, renewable energy systems (like solar inverters), power supplies, and traction systems for electric vehicles. It is designed for high-efficiency switching, making it suitable for applications requiring reliable power management and conversion.

Equivalent

The BSM150GB60DLC chip is an IGBT module from Infineon. Equivalent products include the Mitsubishi CM150DY-24NF, the Semikron SKM150GB126D, and the ON Semiconductor MBS150GB60D. Always verify specifications and compatibility for your specific application needs.

Shipping

Shipping MethodsWe

offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.


Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

Payments

Payment Methods

The Payment term is 100% Prepaid.

Currently, we only accept the below payment methods:

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2. Credit/ Debit Card

3. Wire Transfer