EP3C25F256A7N

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EP3C25F256A7N

IC FPGA 156 I/O 256FBGA

  • Manufacturer
  • Mfr. Part #EP3C25F256A7N
  • Package
  • Datasheet
  • In Stock9183

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Specifications

Series Cyclone® III
Part Status Active
DigiKey Programmable Not Verified
Total RAM Bits 608256
Number of I/O 156
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number EP3C25
Number of Logic Elements/Cells 24624
Number of LABs/CLBs 1539

Overview

Description

The EP3C25F256A7N is a field-programmable gate array (FPGA) from Intel's Cyclone III family. It features a compact 256 Kbits of embedded memory and offers a combination of high performance and low power consumption, making it suitable for various applications, including consumer electronics, automotive, and industrial systems.
This specific model has 25,000 logic elements, enabling complex digital designs, and supports various I/O standards for flexibility in interfacing with other components. The FPGA can be programmed using hardware description languages like VHDL or Verilog, allowing designers to implement custom logic and functionalities suited to their needs.
Additionally, the EP3C25F256A7N incorporates advanced features such as digital signal processing (DSP) blocks, making it effective for applications that require high-speed computations. With its ability to be reprogrammed, it allows for rapid prototyping and iterative design processes, making it a popular choice among engineers and developers.

Features

The EP3C25F256A7N is a low-cost, high-performance FPGA (Field Programmable Gate Array) from Intel's Cyclone III series. Key features include:
1. Logic Elements: It contains 25,000 logic elements, allowing for complex digital designs.
2. Memory: Offers up to 1.5 Mbits of embedded memory and multiple configuration options.
3. I/O Pins: Provides up to 256 user I/O pins with support for various I/O standards.
4. High-Speed Interfaces: Supports fast differential signaling protocols like LVDS.
5. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated applications.
6. Development Support: Compatible with Intel's Quartus Prime software for easy design entry and simulation.
7. Configuration: Can be configured via JTAG, passive or active serial modes.
8. Performance: Operates at a maximum frequency of around 200 MHz, depending on design complexity.
Overall, the EP3C25F256A7N is ideal for applications in communications, automotive, and consumer electronics.

Package

The EP3C25F256A7N is packaged in a 256-pin Fine Pitch Ball Grid Array (FBGA) format.

Pinout

The EP3C25F256A7N is a member of Intel's Cyclone III FPGA family. It features a total of 256 pins. The FPGA is designed for low-cost, low-power applications and offers a range of functionalities, including configurable I/O, digital signal processing capabilities, and various memory interfaces.
The pin configuration includes inputs, outputs, power supply pins, ground pins, and dedicated pins for configuration and clock signals. The device supports multiple I/O standards, allowing flexibility in interfacing with different types of peripherals and communication protocols. Additionally, it provides user-defined logic resources that enable the implementation of custom digital circuits.
Overall, the EP3C25F256A7N is suitable for applications such as consumer electronics, automotive systems, and industrial control systems, delivering a balance of performance and resource efficiency.

Manufacturer

The manufacturer of the EP3C25F256A7N is Intel Corporation. Intel is a multinational corporation and technology company primarily known for designing and manufacturing semiconductor products, including microprocessors, integrated circuits, and various hardware components. Founded in 1968, Intel has played a pivotal role in the development of computing technology and is a key player in the semiconductor industry. The EP3C25F256A7N is part of Intel's Cyclone III FPGA (Field Programmable Gate Array) family, which is used in various applications requiring configurable and adaptable logic solutions. Intel focuses on innovation in areas such as artificial intelligence, cloud computing, and Internet of Things (IoT) technologies, making it a leader in the tech sector.

Application

The EP3C25F256A7N is a Cyclone III FPGA by Intel, used in various applications including digital signal processing, embedded systems, automotive electronics, communications, and industrial control. Its versatility allows for real-time data processing, hardware acceleration, and custom logic implementations, making it suitable for prototyping, video processing, and network systems.

Equivalent

The EP3C25F256A7N is an Altera Cyclone III FPGA. Equivalent products include the Xilinx Spartan-6 series (e.g., XC6SLX25), Lattice Semiconductor's ECP3 FPGAs, and Microsemi's SmartFusion2 series. Make sure to compare specifications like logic cells, I/O capabilities, and power requirements for compatibility.

Shipping

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Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

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