EP3SL150F780I3N

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EP3SL150F780I3N

IC FPGA 488 I/O 780FBGA

  • Manufacturer
  • Mfr. Part #EP3SL150F780I3N
  • Package 780-BBGA, FCBGA
  • Datasheet
  • In Stock7297

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Specifications

Supplier Intel
Package Tray
Series Stratix® III L
ProductStatus Obsolete
NumberofLABs/CLBs 5700
NumberofLogicElements/Cells 142500
TotalRAMBits 6543360
NumberofI/O 488
Voltage-Supply 0.86V ~ 1.15V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 780-BBGA, FCBGA

Overview

Description

EP3SL150F780I3N is a Lattice Semiconductor FPGA in the ECP3SL family. It targets high-density, low-power digital logic in a 780-ball fine-pitch BGA package. The “150” indicates about 150k logic elements, suitable for complex logic, memory interfacing, and DSP-style blocks. The suffix I3N denotes industrial temperature grade with RoHS-compliant packaging; F780 confirms the 780-ball package.
Key features (typical): configurable logic blocks, Block RAM, DSP resources, multiple I/O banks with various I/O standards, and clocking resources (PLLs). It’s designed for applications in networking, video/graphics, data processing, and embedded systems where density matters.
Design flow: HDL (Verilog/VHDL) coding, synthesis/mapping with Lattice Diamond (or compatible tools), placement & routing, bitstream generation, and programming via JTAG or non-volatile memory.
For exact specifications, pinout, and reference designs, consult the EP3SL150F780I3N datasheet and user guide.

Features

EP3SL150F780I3N is a Cyclone III FPGA. Key features:
- 150K logic elements
- 780-pin FineLine BGA package
- Industrial temperature range (-40°C to 85°C)
- Multiple clock management blocks (PLL support)
- On-chip embedded memory (M9K RAM blocks)
- DSP blocks for signal processing
- I/O banks supporting multiple voltage standards (3.3V/2.5V family), wide array of user I/Os
- Configuration options via JTAG, AS/PS (serial/parallel configurations)
- Low-power operation with standard FPGA power-management features
- Suitable for cost-effective, mid-density logic, memory, and DSP applications

Package

It's a Fine-pitch Ball Grid Array package: FBGA780 (780-ball FBGA).

Pinout

- Pin count: 780 pins (FineLine BGA F780)
- Function: Altera/Intel EP3SL150F780I3N is a CPLD (Complex Programmable Logic Device) from the EP3SL family, used to implement digital logic and I/O in a programmable, non-volatile device.

Manufacturer

Manufacturer: Altera Corporation (now part of Intel).
Company type: A semiconductor company that designs and manufactures programmable logic devices (PLDs), including FPGAs and CPLDs, plus related IP and development tools.

Application

EP3SL150F780I3N is a low-power, high-density FPGA used for glue logic, IP integration, and lightweight signal processing in embedded systems. Typical applications include industrial automation/control, automotive electronics, communications interfaces, instrumentation/test equipment, medical devices, aerospace/defense, and consumer electronics. It supports programmable logic, memory interfaces, PLLs, and high-speed I/O (LVDS/SERDES) for versatile data paths.

Shipping

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Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

Payments

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