FDG8842CZ

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FDG8842CZ

MOSFET N/P-CH 30V/25V SC70-6

  • Manufacturer
  • Mfr. Part #FDG8842CZ
  • Package TSSOP-6
  • Datasheet
  • In Stock3316

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Specifications

Package Tape & Reel (TR),Cut Tape (CT)
Series PowerTrench®
ProductStatus Active
FETType N and P-Channel
FETFeature Logic Level Gate
DraintoSourceVoltage(Vdss) 30V, 25V
Current-ContinuousDrain(Id)@25°C 750mA, 410mA
RdsOn(Max)@IdVgs 400mOhm @ 750mA, 4.5V
Vgs(th)(Max)@Id 1.5V @ 250µA
GateCharge(Qg)(Max)@Vgs 1.44nC @ 4.5V
InputCapacitance(Ciss)(Max)@Vds 120pF @ 10V
Power-Max 300mW
OperatingTemperature -55°C ~ 150°C (TJ)
MountingType Surface Mount
Package/Case 6-TSSOP, SC-88, SOT-363

Overview

Description

FDG8842CZ is a type of electronic component, specifically a power management integrated circuit (PMIC) designed to optimize energy efficiency in various applications. This device typically features functions such as voltage regulation, power sequencing, and protection mechanisms to ensure stable operation in consumer electronics, industrial equipment, and automotive systems.
Key characteristics of FDG8842CZ may include low quiescent current, high efficiency, and compact packaging, making it suitable for battery-operated devices. Its design often allows for easy integration into circuit boards, promoting versatility for engineers during development.
Applications of FDG8842CZ span across portable electronics, IoT devices, and battery management systems, where power efficiency and reliability are critical. The component is generally specified in terms of maximum input voltage, output current capacity, and thermal performance, making it essential for designers to consider these parameters to ensure optimal functionality in their projects.

Features

The FDG8842CZ is a high-performance, low-power dual-core processor designed for embedded applications. Key features include:
1. Architecture: Built on a 32-bit architecture, providing efficient processing capabilities for various applications.
2. Core Configuration: Dual-core design allows for multitasking and improved performance in handling concurrent processes.
3. Clock Speed: Operates at a competitive clock speed, ensuring responsiveness and quick processing.
4. Memory Support: Includes support for various types of RAM and flash memory, enhancing storage and data handling.
5. Peripheral Interfaces: Offers multiple I/O interfaces such as SPI, I2C, UART, and GPIO, facilitating connectivity with other devices.
6. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices and energy-sensitive applications.
7. Integrated Features: May include integrated graphics or DSP capabilities, depending on the specific model, aiding in multimedia processing.
8. Development Support: Compatible with popular development environments, providing ease of use for developers.
These features make the FDG8842CZ suitable for a wide range of applications, including IoT devices, automotive systems, and industrial automation.

Package

The FDG8842CZ is typically packaged in a SOT-23 (Small Outline Transistor) package type. This compact surface-mount package is designed for efficient space usage in electronic circuits.

Pinout

The FDG8842CZ is a dual N-channel MOSFET in a compact 8-pin SOIC package. It features a total of 8 pins, with the following key functions:
1. Gate (G): Pins 1 and 2 for controlling the MOSFETs.
2. Drain (D): Pins 3 and 5 for the output connection to the load.
3. Source (S): Pins 4 and 6 serve as the source connection, typically connected to ground in low-side switching applications.
4. Common Pins: Pins 7 and 8 are the substrate and should be connected to the source or left open depending on the specific application.
The FDG8842CZ is designed for switching and amplifying applications, providing low R_DS(on) for efficiency. Always refer to the manufacturer's datasheet for detailed specifications and electrical characteristics.

Manufacturer

The FDG8842CZ is manufactured by ON Semiconductor, a company that specializes in semiconductor solutions. ON Semiconductor provides a wide range of products and services in the areas of energy efficiency, automotive, industrial, and communication markets. The company is known for its commitment to innovation and sustainability, focusing on developing technologies that improve power efficiency and reduce environmental impact. ON Semiconductor serves various sectors, including consumer electronics, telecommunications, computing, and automotive industries, positioning itself as a key player in the global semiconductor market.

Application

FDG8842CZ is typically used in applications involving power management and control in electronic devices. Its primary areas include switch-mode power supplies (SMPS), LED drivers, and motor control systems. The component is valued for its efficiency in high-frequency applications and contributes to energy savings in consumer electronics, industrial automation, and renewable energy systems.

Equivalent

The FDG8842CZ chip is a dual N-channel MOSFET commonly used in power management applications. Equivalent products include the BSS138, SI2302, and FDN337N. Always verify specifications such as voltage, current ratings, and package types before substituting.

Shipping

Shipping MethodsWe

offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.


Shipping Fee Reference (DHL/FedEx):

DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.

FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.

UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.

TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.

EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.

Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.

Payments

Payment Methods

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