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GD25Q64EFIGR
IC FLASH 64MBIT SPI/QUAD 16SOP
- Manufacturer
- Mfr. Part #GD25Q64EFIGR
- Package
- Datasheet
- In Stock9365
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Specifications
| Series | GD25Q |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR (SLC) |
| Memory Size | 64Mbit |
| Memory Organization | 8M x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 70µs, 2.4ms |
| Access Time | 7 ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) |
| Supplier Device Package | 16-SOP |
| Base Product Number | GD25Q64 |
Overview
Description
Key features include a uniform 4KB sector architecture, which facilitates efficient memory management, and support for various programming and erasing modes. The GD25Q64EFIGR is ideal for embedded systems, consumer electronics, and IoT devices, where firmware or data storage is required. Its small form factor and low power consumption make it a popular choice for modern applications. The chip comes in various package options, including SOP and WSON, to accommodate different design requirements.
Features
1. Interface: It uses a Quad SPI (QSPI) interface for high-speed data transfer, supporting up to 104 MHz.
2. Memory Organization: The chip is organized into 8K uniform sectors and has a total of 256 sectors.
3. Voltage Range: Operates at a supply voltage of 2.7V to 3.6V, making it suitable for low-power applications.
4. Program/Erase Cycles: It offers a maximum endurance of 100,000 program/erase cycles per sector and has a data retention of 20 years.
5. Commands: Supports standard commands for Read, Write, Erase, and other functions, along with enhanced commands for faster performance.
6. Package Options: Available in various packages such as SOIC-8, DFN-8, and WSON-8, accommodating different PCB designs.
7. Security Features: It includes features like write protection and manufacturer and device ID for enhanced security.
This combination of features makes the GD25Q64EFIGR suitable for a wide range of applications, including embedded systems, consumer electronics, and automotive devices.
Package
Pinout
1. GND - Ground connection.
2. VCC - Supply voltage (typically 2.7V to 3.6V).
3. SCK - Serial Clock input for data transfer.
4. SI - Serial Input for data programming and instruction.
5. SO - Serial Output for data reading.
6. CS# - Chip Select (active low).
7. WP# - Write Protect (active low).
8. HOLD# - Hold (active low, pauses communication).
9. RESET# - Reset (active low, resets the device).
The device supports SPI (Serial Peripheral Interface) for communication and is commonly used in applications requiring non-volatile storage, such as firmware and data storage in embedded systems.
Manufacturer
Application
Equivalent
1. Winbond W25Q64JV
2. Macronix MX25L6433F
3. Micron MT25QL064A
4. Spansion S25FL064L
These alternatives generally offer similar specifications, including storage capacity and interface type. Always verify specific features and compatibility based on your application requirements.
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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