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LFE3-17EA-6FTN256C
IC FPGA 133 I/O 256FTBGA
- Manufacturer
- Mfr. Part #LFE3-17EA-6FTN256C
- Package FPBGA-256
- Datasheet LFE3-17EA-6FTN256C DataSheet
- In Stock6263
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Specifications
| Package | Tray |
| Series | ECP3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2125 |
| NumberofLogicElements/Cells | 17000 |
| TotalRAMBits | 716800 |
| NumberofI/O | 133 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-BGA |
Overview
Description
Key characteristics include a 6-input LUT (Lookup Table) architecture, a high-speed, flexible interconnect structure, and integrated DSP blocks for efficient signal processing. The device operates at a maximum clock frequency of up to 400 MHz and supports multiple I/O standards, including LVDS and LVCMOS, enhancing its versatility in system designs.
Additionally, the LFE3-17EA-6FTN256C comes in a compact 256-ball FTN package, making it ideal for space-constrained environments. It is programmed using Lattice's Diamond software suite, which facilitates design entry, simulation, and synthesis. Overall, this FPGA offers a balance of performance, power efficiency, and cost-effectiveness for various digital logic applications.
Features
- Device Density: 17K look-up tables (LUTs), suitable for a variety of applications.
- Logic Elements: 256 I/O pins, configurable for various functions.
- Speed Grade: Rated at -6, providing high performance with a maximum operating frequency.
- Low Power Consumption: Designed for battery-operated and energy-efficient applications.
- Programmability: Supports various programming methods including JTAG and SRAM-based configuration.
- Integrated Features: Comes with built-in DSP blocks for efficient signal processing, memory blocks, and phase-locked loops (PLLs).
- I/O Standards: Compatible with multiple I/O standards (e.g., LVTTL, LVCMOS).
- Development Support: Supported by Lattice’s Diamond design software for ease of use in development.
This FPGA is ideal for applications in communications, industrial controls, and consumer electronics, where flexibility and low power are crucial.
Package
Pinout
In terms of functionality, the LFE3-17EA-6FTN256C supports multiple I/O standards, has embedded memory, and allows for a mix of digital signal processing and logic functions, making it suitable for applications in communications, automotive, and industrial control systems. The package type is a Fine Pitch BGA (Ball Grid Array), which allows for a compact design and efficient thermal management.
Overall, the LFE3-17EA-6FTN256C delivers a flexible solution for various digital design needs, combining a moderate logic capacity with rich I/O capabilities.
Manufacturer
Application
Equivalent
1. Xilinx Artix-7 (e.g., XC7A35T)
2. Intel Cyclone V (e.g., 5CEBA2)
3. Microsemi SmartFusion2 (e.g., M2S010)
4. Lattice ECP5 (e.g., LFE5-5EA)
These alternatives vary in specifications and features, so consideration of specific application needs is essential.
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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