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XC2S100-5FG256C
IC FPGA 176 I/O 256FBGA
- Manufacturer
- Mfr. Part #XC2S100-5FG256C
- Package
- Datasheet
- In Stock9337
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Specifications
| Series | Spartan®-II |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 2700 |
| Total RAM Bits | 40960 |
| Number of I/O | 176 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
| Base Product Number | XC2S100 |
| Number of LABs/CLBs | 600 |
| Number of Gates | 100000 |
Overview
Description
Key features include 256 I/O pins, support for various I/O standards, and a maximum clock frequency of up to 200 MHz. The device operates under a 1.8V core voltage, with I/O options at 3.3V, making it suitable for low-power applications. The XC2S100-5FG256C comes in a Fine Pitch Ball Grid Array (FBGA) package, allowing for compact designs.
Applications include digital signal processing, automotive control systems, and consumer electronics. With a flexible architecture, it allows designers to reconfigure circuits to adapt to changing requirements. Overall, the XC2S100-5FG256C is a versatile solution for embedded systems and custom hardware implementation.
Features
1. Logic Cells: It contains 100,000 system gates with 4-input look-up tables (LUTs) and flip-flops, allowing for complex digital logic implementation.
2. Speed Grade: The "-5" designation indicates a maximum clock frequency of up to 200 MHz, suitable for high-performance applications.
3. Package: It comes in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating a compact design footprint.
4. I/O Pins: It provides up to 132 I/O pins, configurable for various voltage standards, enhancing connectivity options.
5. Block RAM: Features embedded block RAM for efficient data storage and access, improving performance for memory-intensive applications.
6. Development Tools: Compatible with Xilinx development tools like ISE, enabling efficient design and programming.
7. Applications: Ideal for consumer electronics, automotive, telecommunications, and industrial control.
These features make the XC2S100-5FG256C versatile for a range of digital design needs.
Package
Pinout
Key functions include the ability to implement complex digital circuits, support for various I/O standards, and the capability to handle high-speed data processing. The "5" in the part number indicates the speed grade, while "FG" denotes the package type, which is a Fine Pitch Ball Grid Array (FBG). This FPGA is suitable for use in communications, automotive, industrial, and consumer electronic applications.
Manufacturer
Application
Equivalent
1. Lattice ispLSI 1016E - Similar FPGA capabilities.
2. Altera MAX 7000 Series - Comparable low-density FPGA options.
3. Xilinx Spartan-3 (e.g., XC3S100) - A newer generation offering better performance.
Always verify pin compatibility and specific application requirements before substituting components.
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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