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XC2V3000-4FF1152I
IC FPGA 720 I/O 1152FCBGA
- Manufacturer
- Mfr. Part #XC2V3000-4FF1152I
- Package
- Datasheet XC2V3000-4FF1152I DataSheet
- In Stock5498
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Specifications
| Series | Virtex®-II |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 1769472 |
| Number of I/O | 720 |
| Number of Gates | 3000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Base Product Number | XC2V3000 |
| Number of LABs/CLBs | 3584 |
Overview
Description
The package type "FF1152" refers to a Fine Pitch Ball Grid Array (FBGA) with 1,152 balls, allowing for a compact design and efficient heat dissipation. The "I" at the end signifies the industrial temperature range, making it suitable for applications in harsh environments.
Key features include high-speed performance, advanced DSP capabilities, and support for multiple I/O standards. The XC2V3000 is commonly used in telecommunications, automotive, and aerospace applications, where flexibility and reliability are crucial. Its programmability allows for rapid prototyping and design iterations, making it a popular choice among engineers and developers.
Features
1. Logic Cells: It contains approximately 3,000 logic cells, which allow for complex digital designs.
2. Embedded Memory: Up to 128 Kbits of block RAM facilitates efficient data storage and manipulation.
3. I/O Capabilities: Supports up to 152 user-configurable I/O pins with various voltage levels.
4. High Performance: Operates at a maximum clock frequency of around 200 MHz, enabling fast processing.
5. Configurable Resources: Includes DSP slices for high-performance arithmetic operations.
6. Power Management: Designed for low power consumption, suitable for portable applications.
7. Package: Housed in a Fine Pitch Ball Grid Array (FBGA) package for compact integration.
8. Development Support: Compatible with Xilinx development tools for design, simulation, and debugging.
This combination of features makes the XC2V3000-4FF1152I suitable for a wide range of applications, from telecommunications to embedded systems.
Package
Pinout
The device is designed for high-performance applications and includes various functionalities such as configurable logic blocks, digital signal processing (DSP) slices, embedded memory, and multiple I/O options. The "4" in the part number indicates the speed grade, which affects performance characteristics. The "FF" indicates the package type, which is a Fine Pitch Ball Grid Array (FBGA). The "I" at the end signifies that it is an industrial-grade part, suitable for extended temperature ranges.
Overall, the XC2V3000-4FF1152I is suitable for applications requiring high levels of integration and flexibility in logic design.
Manufacturer
Application
Equivalent
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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