Images are for reference only
XC3S2000-4FGG456C
IC FPGA 333 I/O 456FBGA
- Manufacturer
- Mfr. Part #XC3S2000-4FGG456C
- Package FBGA-456
- Datasheet
- In Stock4037
100% Original & New
24 Hours ready to ship
365 Days Warranty
RFQ & Get more Discounts
Specifications
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5120 |
| NumberofLogicElements/Cells | 46080 |
| TotalRAMBits | 737280 |
| NumberofI/O | 333 |
| NumberofGates | 2000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 456-BBGA |
Overview
Description
Key specifications include:
- Architecture: Spartan-3, known for its low power consumption and cost-effectiveness.
- Logic Cells: Up to 200,000 equivalent logic cells, enabling complex designs.
- I/O Pins: 456 I/O pins, with support for multiple voltage levels and I/O standards.
- Performance: Operates at clock speeds of up to 200 MHz, suitable for high-speed applications.
- Package Type: FGG (Fine Pitch Ball Grid Array) for enhanced thermal performance and reliability.
The XC3S2000 is often used in prototyping and development environments, where flexibility and reconfigurability are essential. Its combination of features makes it a popular choice for varied applications, from simple control systems to more complex digital signal processing tasks.
Features
- Logic Cells: Approximately 2 million system gates and up to 200,000 logic cells.
- I/O Pins: Offers up to 456 user I/O pins, supporting various I/O standards such as LVTTL, LVCMOS, and PCI.
- Memory: Supports up to 128 Kbits of block RAM, enabling efficient data storage and manipulation.
- DSP Slices: Contains dedicated DSP slices for high-performance digital signal processing applications.
- Configuration: Supports multiple configuration methods including JTAG, SPI, and parallel modes.
- Clock Management: Integrated clock management features, including Phase-Locked Loops (PLLs) and clock dividers.
- Power: Operates with a low power consumption profile, making it suitable for battery-powered applications.
- Package: Available in a fine-pitch ball grid array (FBGA) package, providing a compact footprint.
Overall, the XC3S2000-4FGG456C is designed for versatility in various digital logic applications, including communications, automotive, and consumer electronics.
Package
Pinout
Manufacturer
Application
Equivalent
1. Lattice ECP3 - ECP3-70
2. Altera Cyclone III - EP3C20
3. Microsemi SmartFusion - M2S010
4. Lattice MachXO - MachXO2-256
These alternatives vary in features and specifications, so it's important to evaluate specific application requirements.
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
Similar
-
MX29F400CBTI-70G
Macronix
-
MX25V5126FM1I
Macronix
-
MX25V4035FZUI
Macronix
-
MX25V16066M1I02
Macronix
-
MX25V16066M2I02
Macronix
-
MX25L8035EM2I-10G
Macronix
-
MX25U51279GXDR00
Macronix
-
MX25U25643GZNI00
Macronix
-
MX25V1635FM2I
Macronix
-
MX25L12833FZ2I-10..
Macronix
-
MX29F040CQI-70G
Macronix
-
MX29LV640ETTI-70G
Macronix