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XCKU040-2FFVA1156E
IC FPGA 520 I/O 1156FCBGA
- Manufacturer
- Mfr. Part #XCKU040-2FFVA1156E
- Package FCBGA-1156
- Datasheet
- In Stock3093
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Specifications
| Package | Tray |
| Series | Kintex® UltraScale™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 30300 |
| NumberofLogicElements/Cells | 530250 |
| TotalRAMBits | 21606000 |
| NumberofI/O | 520 |
| Voltage-Supply | 0.922V ~ 0.979V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA, FCBGA |
Overview
Description
With a 2.5D architecture, this FPGA features advanced processing capabilities, including numerous configurable logic blocks (CLBs), digital signal processing (DSP) slices, and I/O resources. The FFVA1156E package indicates a flip-chip ball grid array (BGA) with 1156 pins, suitable for high-density applications.
Key attributes include support for high-speed serial transceivers, superior clock management, and extensive connectivity options, making it ideal for applications in telecommunications, automotive, aerospace, and data processing. Additionally, it supports various development tools and IP cores, facilitating rapid design and deployment for engineers and developers. Overall, the XCKU040-2FFVA1156E is a versatile solution for complex digital design challenges.
Features
1. Logic Cells: Approximately 40,000 logic cells for complex designs.
2. DSP Slices: 120 DSP slices optimized for high-speed signal processing.
3. Memory: Up to 2.2 Mb of block RAM for efficient data storage and retrieval.
4. Transceivers: Up to 16 GTP transceivers supporting data rates up to 12.5 Gbps, ideal for high-speed connectivity.
5. I/O Capabilities: Supports a wide range of I/O standards, including LVDS, LVCMOS, and others, with a total of 300 user I/Os.
6. Power Efficiency: Low power consumption compared to traditional FPGAs, making it suitable for energy-sensitive applications.
7. Advanced Features: Supports PCIe Gen3, Serial RapidIO, and high-speed Ethernet interfaces.
8. Configuration Options: Can be configured using various methods, including JTAG and SPI.
The XCKU040-2FFVA1156E is ideal for applications in telecommunications, automotive, and data center infrastructures.
Package
Pinout
Manufacturer
Application
Equivalent
1. Intel Arria 10 GX: Similar performance but from Intel.
2. Lattice ECP5: Lower power, suitable for cost-sensitive applications.
3. Microsemi SmartFusion 2: Combines FPGA with ARM processor.
4. Lattice MachXO3: Low power, smaller scale applications.
Always verify specific requirements like I/O count, performance, and power consumption for compatibility.
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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