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XCV100E-6FG256C
IC FPGA 176 I/O 256FBGA
- Manufacturer
- Mfr. Part #XCV100E-6FG256C
- Package
- Datasheet
- In Stock8883
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Specifications
| Series | Virtex®-E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 2700 |
| Total RAM Bits | 81920 |
| Number of I/O | 176 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
| Base Product Number | XCV100E |
| Number of LABs/CLBs | 600 |
| Number of Gates | 128236 |
Overview
Description
Key attributes include advanced digital signal processing capabilities, high-speed serial connectivity, and support for multiple I/O standards. The architecture supports a combination of configurable logic blocks and dedicated hardware for specific tasks, making it suitable for applications in telecommunications, aerospace, and automotive systems.
Additionally, the XCV100E-6FG256C offers user flexibility with reconfigurability, enabling developers to update functionality after deployment. Xilinx provides comprehensive development tools, including the ISE Design Suite, facilitating design, simulation, and debugging processes. Overall, this FPGA is ideal for applications requiring high speed, complex logic processing, and adaptability.
Features
1. Logic Cells: It contains 100,000 system gates and up to 6,144 logic cells, providing ample capacity for complex designs.
2. Speed Grade: The "-6" indicates a performance grade, optimized for high-speed applications, supporting operational speeds suitable for demanding tasks.
3. Package: It comes in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating effective heat dissipation and compact design.
4. I/O Support: The device supports various I/O standards with up to 120 user-configurable I/O pins, enabling versatility in interfacing.
5. Embedded Resources: Includes dedicated block RAM and DSP slices for efficient data processing and storage.
6. Configuration: Supports multiple configuration methods (JTAG, SPI, etc.) for flexibility in deployment.
7. Development Tools: Compatible with Xilinx design tools, enabling effective development and simulation.
Overall, the XCV100E-6FG256C is designed for applications requiring high performance, flexibility, and integration capabilities.
Package
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Manufacturer
Application
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Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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