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XCVU19P-2FSVB3824E
IC FPGA VIRTEX-UP 3824FCBGA
- Manufacturer
- Mfr. Part #XCVU19P-2FSVB3824E
- Package 3824-BBGA
- Datasheet
- In Stock5608
100% Original & New
24 Hours ready to ship
365 Days Warranty
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Specifications
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 510720 |
| NumberofLogicElements/Cells | 8937600 |
| TotalRAMBits | 79586918 |
| NumberofI/O | 1760 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 3824-BBGA, FCBGA |
Overview
Description
Key specifications include a large number of programmable logic cells, high-speed serial transceivers, and integrated DSP slices, making it suitable for complex algorithms and real-time processing. The device supports various connectivity options including PCIe, Ethernet, and CXL, facilitating integration into modern data infrastructures.
The architecture is optimized for adaptability, enabling developers to implement custom hardware accelerators and optimize workloads for specific applications. Additionally, it supports advanced software frameworks for ease of development and deployment, catering to a wide range of industries from telecommunications to automotive.
Overall, the XCVU19P-2FSVB3824E is ideal for users seeking flexible, high-performance solutions to tackle demanding computational tasks and drive innovation in various technological domains.
Features
1. Architecture: Utilizes advanced 16nm FinFET technology, providing improved performance and power efficiency.
2. Logic Cells: Offers a substantial number of logic cells for complex processing tasks.
3. Memory: Integrates large amounts of on-chip memory, including block RAM and UltraRAM, enabling efficient data handling.
4. I/O Capabilities: Supports a wide range of high-speed I/O interfaces, including PCIe Gen4, allowing for fast data transfer.
5. DSP Slices: Incorporates numerous DSP slices optimized for signal processing applications.
6. Clocking Resources: Features advanced clock management capabilities for enhanced performance.
7. Scalability: Suitable for diverse applications from data centers to telecommunications, automotive, and industrial systems.
In summary, the XCVU19P-2FSVB3824E is designed for high-performance and versatile applications, making it ideal for demanding computational tasks.
Package
Pinout
The device features a rich set of functionalities including programmable logic, high-speed transceivers, and various I/O standards. It supports multiple interfaces such as PCIe, Ethernet, and serial connectivity, making it suitable for applications in data centers, telecommunications, and high-performance computing.
Additionally, it provides enhanced power efficiency and advanced features like integrated DSP slices and block RAM, catering to a wide range of use cases in complex computing environments.
Manufacturer
Application
Equivalent
1. XCVU19P-2FSVB2104E
2. XCVU19P-2FSVB2112E
3. XCVU19P-2FSVB3824E (other speed grades may vary)
Always verify specific features, I/O capabilities, and power requirements for your application.
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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