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XCVU3P-2FFVC1517E
IC FPGA 520 I/O 1517FCBGA
- Manufacturer
- Mfr. Part #XCVU3P-2FFVC1517E
- Package
- Datasheet
- In Stock6984
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Specifications
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 862050 |
| Total RAM Bits | 130355200 |
| Number of I/O | 520 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Base Product Number | XCVU3 |
| Number of LABs/CLBs | 49260 |
Overview
Description
Key specifications include 3 million logic cells, 1,150 DSP slices for digital signal processing applications, and extensive memory resources. The device is available in a 1517-ball FFG package, which facilitates high-density designs and provides a balanced I/O configuration.
The XCVU3P is ideal for applications in data centers, telecommunications, and industrial automation, enabling developers to implement complex algorithms and accelerate data processing tasks with ease. It supports development through Xilinx’s Vivado Design Suite, offering tools for hardware design, simulation, and debugging. This makes the XCVU3P a versatile choice for engineers looking to leverage FPGA technology in cutting-edge applications.
Features
1. Architecture: Built on a 16nm FinFET process technology, enabling higher performance and lower power consumption.
2. Logic Cells: Approximately 1.3 million logic cells, offering extensive programmable logic resources for complex applications.
3. DSP Slices: Contains a significant number of DSP48E2 slices for high-performance digital signal processing tasks.
4. Memory: Includes embedded block RAM (BRAM) and UltraRAM, providing flexible memory options for data storage.
5. I/O Ports: Supports high-speed serial transceivers for data communication, with numerous I/O configurations.
6. Power Management: Enhanced power options for efficiency and thermal management, suitable for a wide range of applications.
7. Applications: Ideal for data centers, telecommunications, automotive, and industrial applications requiring high performance and adaptability.
This FPGA is designed for applications that demand high throughput and flexibility in processing and connectivity.
Package
Pinout
Manufacturer
Application
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Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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