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XCZU19EG-2FFVB1517I
IC SOC CORTEX-A53 1517FCBGA
- Manufacturer
- Mfr. Part #XCZU19EG-2FFVB1517I
- Package
- Datasheet
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Specifications
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Base Product Number | XCZU19 |
Overview
Description
Key features include:
- FPGA Fabric: A large amount of programmable logic provides user-defined hardware acceleration capabilities.
- Memory Interface: Supports various memory types, enhancing data processing speed.
- Connectivity: Includes multiple high-speed interfaces such as PCIe, USB, and Ethernet, facilitating extensive communication options.
- Power Efficiency: Designed for low power consumption while maintaining high performance, making it suitable for embedded applications in industrial, automotive, and telecommunications sectors.
The XCZU19EG-2FFVB1517I is ideal for applications requiring high computational power combined with customizable hardware logic, enabling efficient execution of complex tasks.
Features
1. Processing: Quad-core ARM Cortex-A53 (64-bit) and dual-core ARM Cortex-R5 for real-time processing.
2. FPGA Fabric: Integrated programmable logic with a significant number of configurable logic blocks (CLBs) for custom digital design.
3. DSP Slices: High-performance DSP slices for signal processing applications.
4. Memory: Supports DDR4 memory interfaces, enabling high bandwidth memory access.
5. I/O: Multiple high-speed I/O interfaces including PCIe, SATA, and USB for connectivity.
6. Power Efficiency: Designed for low power consumption, making it suitable for embedded applications.
7. Security: Built-in security features for data protection and secure boot.
This SoC is ideal for applications in automotive, industrial, and communications sectors, providing a powerful platform for deploying complex algorithms and real-time processing tasks.
Package
Pinout
The functions of the pins include a variety of digital I/O capabilities, power supply pins, and dedicated interfaces such as PCIe, Ethernet, and USB. It also supports high-speed transceivers, LVDS, and multiple general-purpose I/O (GPIO) configurations. The design is optimized for applications in communications, automotive, industrial, and aerospace sectors, providing flexibility for implementing custom logic alongside powerful processing capabilities.
Manufacturer
Application
Equivalent
Shipping
Shipping MethodsWe
offer global shipping services through DHL, FedEx, TNT, UPS, or any other forwarder of your choice.
Shipping Fee Reference (DHL/FedEx):
DHL: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 2-5 business days.
FedEx: Shipping cost ranges from $25-$40 (0.5kg), with an estimated delivery time of 3-7 business days.
UPS: Shipping cost ranges from $25-$45 (0.5kg), with an estimated delivery time of 3-7 business days.
TNT: Shipping cost ranges from $25-$65 (0.5kg), with an estimated delivery time of 3-7 business days.
EMS: Shipping cost ranges from $30-$50 (0.5kg), with an estimated delivery time of 7-15 business days.
Registered Air Mail: Shipping cost is $2-$4 (0.1kg), with an estimated delivery time of 5-20 business days.
Payments
Payment Methods
The Payment term is 100% Prepaid.
Currently, we only accept the below payment methods:
1. PayPal
2. Credit/ Debit Card
3. Wire Transfer
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